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Pg1-2. |
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The Series
E supports the following:-
- 4 standard
72 pin SIMM memory slots
- Ethernet
controller
- 2 x async
serial ports + 2 sync serial ports
- 1 x parallel
port
- 3 x PCI
expansion slots
- PS2 Floppy
disk drive & CD-Rom
- 3 x peripheral
bays
- SCSI
device expansion module for additional SCSI device
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| MOTHERBOARD |
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The Series
E motherboard contains the PowerPC microprocessor, SIMM slots, SCSI interface,
Ethernet LAN, parallel and serial I/O and keyboard and mouse ports.
A PCI riser
card supports up to 3, short form, cards.
A connector
for the floppy disk and an optional 16 bit audio card are provided.
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| ENCLOSURE
Fig 1.1 |
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The enclosure
contains:-
- Motherboard
- PCI riser
card
- Floppy
disk access
- 7 SCSi
device bays
The enclosure
contains an autoranging psu. The base enclosure can be expanded with a
SCSI Device Expansion module fig 1.2.
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| INSTALLATION |
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- Locate
the system in a stable area - free from excess movement/vibration.
- Allow
at least 6" of space around all sides of the system.
- Install
stacks at least 18" apart.
- Provide
an area free of excess heat, dust, smoke and ESD.
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| LED
INDICATORS Fig 1.2 |
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LED's on
the front panel indicate the status of system power, disk activity etc
as per table 2.1 below.
| Power
Good (Green):- |
AC
power on |
| SCSI
Activity (Green):- |
SCSI
activity |
| ETHERNET
Activity (Green):- |
Ethernet
traffic detected |
| Overtemperature
Detection (Amber):- |
Lit
when lower temperature threshold is reached. If the second threshold
is met the system will shut down. |
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KEYSWITCH
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The keyswitch
is located in the front of the system. Two keys are shipped with the system.
The keys are stored under the crown.
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| REAR
PANEL CONNECTORS |
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Figure 2.3
and 2.4 details the rear panel connectors. Fig 2.4 shows the addition
of the SCSI Device Expansion module.
The following
table describes the type and function of the rear panel connectors.
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SYSTEM
SPECIFICATIONS
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The Power
Series E requires minimum maintenance and care to keep it operating correctly.
For optimum performance it is best to place the computer in the middle
of these environmental ranges.
| Input
Voltage: |
115
Vac/230 Vac, 50Hz/60Hz |
| Emissions: |
FCC
class B; FTZ class B |
| Electrostatic
Discharge: |
| 5000
volts: |
No
observable effect |
| 12000
volts: |
No
operator- perceived errors |
| 24000
volts: |
No
permanent equipment damage |
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| Altitude:
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| Operating: |
10000
feet (3048m) |
| Non
Operating: |
30000
feet (9144m) |
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| Noise
level: |
50dBA
maximum |
| Temperature: |
| Operating: |
5
C to 35 C (41 F to 95 F) |
| Non
Operating: |
-25
C to 65 C (-13 F to 149 F) |
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| Relative
Humidity: |
| Operating: |
20%
to 80% |
| Non
Operating: |
10%
to 90% |
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| Shock:
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| Operating: |
0.5G |
| Non
Operating: |
15G |
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|
| TAKING
THE POWER SERIES E APART |
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| BEFORE
DISASSEMBLING:- |
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1.
Use Esd precautions at all times.
2.
Do not operate the system with the cover removed. ALWAYS replace
the cover before powering on the system.
NB: NO
TOOLS ARE REQUIRED FOR THIS PROCEDURE |
| REMOVING
THE CROWN AND COVER |
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1.
Grasp the crown by the front, top edges and push up until the crown
releases from the cover.
2.
Lift the crown up, disengaging it from the tabs on the rear of the
cover and set aside.
3.
Grasp the rear, back edges of the cover and pull out and up, releasing
the cover from the chassis.
4.
Slide the cover forward along it's rails and set aside.
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| REPLACING
THE SYSTEMS COVER |
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1.
Position the cover over the front of the chassis and into the guides
along the sides of the chassis.
Push
the cover toward the rear until the back catches of the cover engage
into the slots on the chassis.
2.
The cover should be aligned on all sides of the chassis. You should
hear a click as the bezel snaps into place.
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| REPLACING
THE CROWN |
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1.
Locate the tabs on the rear of the crown. Align these tabs with
those on the top of the bezel.
2.
Pull the crown forward and push down.
The
crown should snap into position.
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| REMOVING
THE FRONT BASE OF THE SCSI MODULE |
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1.
Remove the crown as previously detailed.
2.
Remove the front bezel of the top module by pushing inward on the
bezel release latches located on the bottom of the bezel. Lift the
bezel upward until it is free of the module.
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| REMOVING
THE RISER CARD ASSEMBLY |
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1.
Remove the crown and cover as detailed previously to reveal the
riser card.
2.
Release the metal catches on the front and back sides.
3.
Remove all cards from the side by grasping the outer edge of the
card and pulling firmly until the card releases from the riser.
4.
To remove the plastic bracket containing the riser card, lift up
until the unit completely disengages from the connectors on the
motherboard.
5.
To remove the riser card from the plastic bracket, grasp both edges
of the bracket and spread the release clips until the riser card
disengages from the bracket.
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| REMOVING
THE MOTHERBOARD |
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1.
If a SCSI device expansion module is installed, remove all cables
connecting it to the system module. Remove the expansions module.
Remove the system's crown and cover.
2.
Remove all drive modules and any modules installed in the expansion
slots.
3.
Remove the riser card and plastic carrier.
4.
Disconnect the power supply connectors from the system board. Disconnect
any other devices or cables that would prohibit removing the motherboard.
5.
Grasp the black handle located to the left of the SIMM slots. Pull
the handle toward the front of the
enclosure until the motherboard releases from the connectors on
the backplane of the unit. Lift up to remove the board.
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| REMOVING
THE POWER SUPPLY/FAN ASSEMBLY |
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1.
Remove the crown and enclosure cover.
2.
The power supply/fan assembly is released from the chassis by pushing
in the release button located on the
side of the assembly. The assembly can then be lifted up and out
of the chassis.
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