Technical Specifications

Dell™ PowerEdge™ 1850 Systems User's Guide

Processor

Processor type

Up to two Intel® Xeon^™ processors with a minimum clock speed of at least 2.8 GHz

Front-side bus speed

800 MHz

L2 cache

at least 1MB internal cache

Processor
Processor type	Up to two Intel® Xeon^™ processors with a minimum clock speed of at least 2.8 GHz
Front-side bus speed	800 MHz
L2 cache	at least 1MB internal cache

Expansion Bus

Bus type

PCI-X, PCI Express

Expansion slots via riser card:

PCI-X

one 3.3-V, 64-bit, 100-MHz and one 3.3-V, 64 bit, 133MHz

PCI Express

one x4 lane width (when available)
one x8 lane width (when available)

Expansion Bus
Bus type	PCI-X, PCI Express
Expansion slots via riser card:
PCI-X	one 3.3-V, 64-bit, 100-MHz and one 3.3-V, 64 bit, 133MHz
PCI Express	one x4 lane width (when available) one x8 lane width (when available)

Memory

Architecture

144-bit ECC registered PC2-3200 DDR2 SDRAM DIMMs, with two-way interleaving, rated for 400-MHz operation

Memory module sockets

Six 240-pin

Memory module capacities

256 MB, 512 MB, 1 GB, 2 GB, or 4 GB (when available)

Minimum RAM

256 MB (one 256-MB module)

Maximum RAM

16 GB

Memory
Architecture	144-bit ECC registered PC2-3200 DDR2 SDRAM DIMMs, with two-way interleaving, rated for 400-MHz operation
Memory module sockets	Six 240-pin
Memory module capacities	256 MB, 512 MB, 1 GB, 2 GB, or 4 GB (when available)
Minimum RAM	256 MB (one 256-MB module)
Maximum RAM	16 GB

Drives

SCSI hard drives

up to two 1-inch, internal, hot-plug, Ultra320 SCSI

Diskette drive

one optional 3.5-inch, 1.44-MB
external optional USB 3.5-inch, 1.44-MB

Optical drive

one optional IDE CD or DVD
external optional USB CD

Flash drive

external optional USB

Drives
SCSI hard drives	up to two 1-inch, internal, hot-plug, Ultra320 SCSI
Diskette drive	one optional 3.5-inch, 1.44-MB external optional USB 3.5-inch, 1.44-MB
Optical drive	one optional IDE CD or DVD external optional USB CD
Flash drive	external optional USB

Connectors

Externally accessible

Back

NIC

Two RJ-45 (for integrated 1-Gigabit NICs)

PS/2-style keyboard

6-pin mini-DIN

PS/2-compatible mouse

6-pin mini-DIN

Serial

9-pin, DTE, 16550-compatible

USB

Two 4-pin, USB 2.0 compliant

Video

15-pin VGA

Front

Video

15 pin

USB

Two 4-pin, USB 2.0 compliant

Internally accessible

SCSI channels

One 68-pin U320 SCSI

Connectors
Externally accessible
Back
NIC	Two RJ-45 (for integrated 1-Gigabit NICs)
PS/2-style keyboard	6-pin mini-DIN
PS/2-compatible mouse	6-pin mini-DIN
Serial	9-pin, DTE, 16550-compatible
USB	Two 4-pin, USB 2.0 compliant
Video	15-pin VGA
Front
Video	15 pin
USB	Two 4-pin, USB 2.0 compliant
Internally accessible
SCSI channels	One 68-pin U320 SCSI

Video

Video type

ATI Radeon 7000-M video controller; VGA connectors

Video memory

16 MB

Video
Video type	ATI Radeon 7000-M video controller; VGA connectors
Video memory	16 MB

Power

AC power supply (per power supply)

Wattage

550 W

Voltage

84 -264 VAC, autoranging, 47-63 Hz, 7.6 A

Heat dissipation

2130 BTU/hr (theoretical maximum)

Maximum inrush current

Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 25 A per power supply for 10 ms or less.

Batteries

System battery

CR 2032 3.0-V lithium ion coin cell

ROMB battery (optional)

4.1-V lithium ion

Power
AC power supply (per power supply)
Wattage	550 W
Voltage	84 -264 VAC, autoranging, 47-63 Hz, 7.6 A
Heat dissipation	2130 BTU/hr (theoretical maximum)
Maximum inrush current	Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 25 A per power supply for 10 ms or less.
Batteries
System battery	CR 2032 3.0-V lithium ion coin cell
ROMB battery (optional)	4.1-V lithium ion

Physical

Height

4.29 cm (1.69 in)

Width

48.26 cm (19 in)

Depth

76.2 cm (30 in)

Weight (maximum configuration)

17.69 kg (39 lb)

Physical
Height	4.29 cm (1.69 in)
Width	48.26 cm (19 in)
Depth	76.2 cm (30 in)
Weight (maximum configuration)	17.69 kg (39 lb)

Environmental

NOTE: For additional information about environmental measurements for specific system configurations, see www.dell.com/environmental_datasheets.

Temperature

Operating

10° to 35°C (50° to 95°F)

Storage

–40° to 65°C (–40° to 149°F)

Relative humidity

Operating

8% to 85% (noncondensing) with a maximum humidity gradation of 10% per hour

Storage

5% to 95% (noncondensing)

Maximum vibration

Operating

0.25 G at 3–200 Hz for 15 min

Storage

0.5 G at 3–200 Hz for 15 min

Maximum shock

Operating

One shock pulse in the positive z axis (one pulse on each side of the system) of 41 G for up to 2 ms

Storage

Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms

Altitude

Operating

–16 to 3048 m (–50 to 10,000 ft)

Storage

–16 to 10,600 m (–50 to 35,000 ft)

Environmental
NOTE: For additional information about environmental measurements for specific system configurations, see www.dell.com/environmental_datasheets.
Temperature
Operating	10° to 35°C (50° to 95°F)
Storage	–40° to 65°C (–40° to 149°F)
Relative humidity
Operating	8% to 85% (noncondensing) with a maximum humidity gradation of 10% per hour
Storage	5% to 95% (noncondensing)
Maximum vibration
Operating	0.25 G at 3–200 Hz for 15 min
Storage	0.5 G at 3–200 Hz for 15 min
Maximum shock
Operating	One shock pulse in the positive z axis (one pulse on each side of the system) of 41 G for up to 2 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating	–16 to 3048 m (–50 to 10,000 ft)
Storage	–16 to 10,600 m (–50 to 35,000 ft)

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